Aerotech GmbH

Aerotech

Detachable Optical Interfaces and Simultaneous Multichannel Alignment

As hyperscale data centers transition to 1.6T and 3.2T optical interconnects to satisfy AI and machine learning computational workloads, co-packaged optics (CPO) and silicon photonics (PICs) have moved from laboratory demonstrations to high-volume manufacturing. Yet, optical packaging and active alignment remain among the most expensive, yield-limiting steps in the entire photonic supply chain.

Traditional alignment algorithms were engineered for single fibers or duplex channels. When applied to multichannel optical arrays, engineers are forced into an iterative compromise: optimizing outer channels sequentially while "hoping for the best" across intermediate channels. This results in slow cycle times, severe Insertion Loss (IL) penalties, and inconsistent device yields.

In this technical livestream, Justin Bressi (Aerotech) and George Ong, Ph. D. (Senko Advanced Components) detail an integrated, multi-company architecture designed to dismantle this bottleneck.

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